Manufacturing Process » History » Revision 12
Revision 11 (Dimitris Pipelias, 11/18/2025 01:28 PM) → Revision 12/18 (Dimitris Pipelias, 11/18/2025 01:36 PM)
# Manufacturing Process # # # ### 1. PCB Manufacturing / Soldering Description of the printed circuit board (PCB) manufacturing and soldering process. 1. PCB preparation 2. Component placement 3. Soldering process 4. Visual inspection 📌 Note: Insert photos here showing the PCB manufacturing steps. # ### 2. Components Assembly Description of the procedure for assembling the electronic components of the amplifier. 1. Module placement 2. Wiring 3. Securing components 4. Functional testing 📌 Note: Insert images here showing assembly steps. # # ## 3. Testing / Case Assembly # ### • Initial test  1. Visual inspection to ensure that all components on the board are correctly placed. 📌 Note: 2. Check for a missing coil, as this is a common failure point (Fig. 1). 2. 3. Set the HDMOD-1 source (with RF output of 90dB) on channel 21 (MHz: fill in the exact frequency). 3. 4. Connect the output to a 20dB attenuator. 4. 5. Measure the PWR level at the output of the 20dB attenuator using the field meter. The desired power value to confirm correct operation of the source before connecting the amplifier is 69dBuV (Fig. 2). 📌 Note: 90dB (source) – 20dB (attenuator) + 36dB (DA102 amplifier) – 1dB (cable losses) = 69dB.  5. 6. Place the amplifier between the source and the field meter, and power it with 12V DC, verifying a current consumption of approximately 270mA (Fig. 3). 6. 7. Set the attenuation and equalizer switches to their maximum position (Fig. 4). 7. 8. Connect the output to a 30dB attenuator (required due to the DA102 36dB gain). 8. 9. Measure the PWR level at the output of the 30dB attenuator using the field meter. The desired power value to confirm correct operation of the DA102 amplifier is 75dB (Fig. 5). 📌 Note: 90dB (source) – 20dB (first attenuator) + 36dB (DA102 amplifier) – 30dB (second attenuator) – 1dB (cable losses) = 75dBuV. # # ### • Case Assembly  1. Local removal of the Solder Mask (green coating) (Fig. 6) using an appropriate tool, in order to expose the Copper Layer (copper coating) (Fig. 7). coating). 📌 Note: Soldering is performed between the PCB copper surface and the metal surface of the case, as solder cannot adhere to the Solder Mask. 📌 Note: *This step may be omitted in the future with a redesigned PCB.* 2. Tightening of the nuts and placement of the washers, preparing the board for insertion into the metal case (Fig. 8). case. 📌 Note: The internal nuts should be tightened only until they make contact with the SMT connectors—no additional torque should be applied. The washers must be oriented so that the flat side faces the nut, while the curved side faces the metal case that will be installed in the next step.  3. Set the HDMOD-1 source to an RF output of 90dB on channel 21 (MHz: fill in the exact frequency). 4. Connect the output to a 20dB attenuator. ### Step-by-Step Workflow 1. Materials and PCB reception 2. Incoming quality control 3. Soldering and visual inspection 4. Components assembly 5. Wiring 6. Housing installation 7. Final functional testing 8. Packaging 📌 Note: Insert diagrams or pictures illustrating the workflow.