Manufacturing Process¶

1. PCB Manufacturing / Soldering¶

Description of the printed circuit board (PCB) manufacturing and soldering process.

1. PCB preparation
2. Component placement
3. Soldering process
4. Visual inspection
   📌 Note: Insert photos here showing the PCB manufacturing steps.

2. Components Assembly¶

Description of the procedure for assembling the electronic components of the amplifier.

1. Module placement
2. Wiring
3. Securing components
4. Functional testing
   📌 Note: Insert images here showing assembly steps.

3. Testing / Case Assembly¶

• Functional test¶

1. Visual inspection to ensure that all components on the board are correctly placed.
   📌 Note: Check for a missing coil, as this is a common failure point (Fig. 1).
2. Set the HDMOD-1 source (with RF output of 90dB) on channel 21 (MHz: fill in the exact frequency).
3. Connect the output to a 20dB attenuator.
4. Measure the PWR level at the output of the 20dB attenuator using the field meter. The desired power value to confirm correct operation of the source before connecting the amplifier is 69dBuV (Fig. 2).
   📌 Note: 90dB (source) – 20dB (attenuator) + 36dB (DA102 amplifier) – 1dB (cable losses) = 69dB.

5. Place the amplifier between the source and the field meter, and power it with 12V DC, verifying a current consumption of approximately 270mA (Fig. 3).
6. Set the attenuation and equalizer switches to their maximum position (Fig. 4).
7. Connect the output to a 30dB attenuator (required due to the DA102 36dB gain).
8. Measure the PWR level at the output of the 30dB attenuator using the field meter. The desired power value to confirm correct operation of the DA102 amplifier is 75dB (Fig. 5).
   📌 Note: 90dB (source) – 20dB (first attenuator) + 36dB (DA102 amplifier) – 30dB (second attenuator) – 1dB (cable losses) = 75dBuV.

• Case Assembly¶

1. Local removal of the Solder Mask (green coating) (Fig. 6) using an appropriate tool, in order to expose the Copper Layer (copper coating) (Fig. 7).
   📌 Note: Soldering is performed between the PCB copper surface and the metal surface of the case, as solder cannot adhere to the Solder Mask.
   📌 Note: This step may be omitted in the future with a redesigned PCB.
2. Tightening of the nuts and placement of the washers, preparing the board for insertion into the metal case (Fig. 8).
   📌 Note: The internal nuts should be tightened only until they make contact with the SMT connectors—no additional torque should be applied. The washers must be oriented so that the flat side faces the nut, while the curved side faces the metal case that will be installed in the next step.

3. Insert the PCB into the metal enclosure, ensuring that the openings where the SMT connectors protrude have the two washers positioned on each side.
4. Place the two metal rods, which hold the PCB at the required height from the bottom of the enclosure (Fig. 9).
5. Solder the PCB to the enclosure using a soldering iron around the perimeter, at the points where the copper layer is exposed, and then remove the metal rods.
6. Tighten the nuts onto the enclosure using slim adjustable wrenches that can fit inside the enclosure (Fig. 10).
   📌 Note: The nuts on both connectors must be tightened evenly to avoid bending or deforming the metal surface between them.
7. Install and secure the metal cover (Fig. 11).

8. Install the metal base and the two side panels (Fig. 12), after first removing the protective adhesive film from the base (Fig. 13).
9. Align and secure the amplifier to the base and side panels, fastening it diagonally with 4 Phillips 3×6 screws (Fig. 14).

10. Vertically position the metal top cover of the case (Fig. 15), ensuring that the two switches and the LED align correctly with their respective openings.
11. Secure the cover to the main body, fastening it diagonally with 4 Allen 3×6 screws (Fig. 16).

• Network and Spectrum Analyzer test¶

1. Local removal

Step-by-Step Workflow¶

1. Materials and PCB reception
2. Incoming quality control
3. Soldering and visual inspection
4. Components assembly
5. Wiring
6. Housing installation
7. Final functional testing
8. Packaging
   📌 Note: Insert diagrams or pictures illustrating the workflow.